AMD couldn’t have expected Intel wouldn’t be snapping at its heels soon after announcing yesterday they’d be supporting USB 3.0 in two upcoming chipsets. Though AMD didn’t specify a timeframe, Intel has said their Ivy Bridge silicon would debut in 2012 – and told developers to work on both Thunderbolt and USB 3.0 [CNET]
You may’ve noticed there are many laptops and PCs out there that support USB 3.0 now, but unfortunately both AMD and Intel haven’t added support for the latest version in their chipsets before. This is set to change with AMD’s A75 and A70M chipsets, which will be the first to be branded “Superspeed USB”. Previously, PC builders have had to use third-party controllers if they wanted to include the much-faster USB 3.0. [The Inquirer]
Digitimes says Apple could avoid facing iPad and iPhone shortages by using their sizable supply of cash to outbid competitors for touch panels. Even before the Japan earthquake caused concern about Asian manufacturing capabilities, there had been worries about availability.
With three cameras, iFixit reckons “this is the most camera-laden device we’ve ever taken apart”, but what exactly is inside that Japanese 3DS? As we know, it uses two cameras for recording 3D, but also displays 3D footage through a parallax barrier layer.
Toshiba’s apparently investing $US1.19 billion building a Japanese factory devoted entirely to making iPhone LCDs. Work on the factory will commence later next year, so if Toshiba gets the contract for iPhone 5 screens, they’ll have to be made elsewhere.
