Benchmarks? Old school. Thermal imaging? Totally last year. No, if you want to prove just how awesome your mobile CPUs are in 2012, you stick a cube of butter on them and watch how fast they melt.
Clearly, it’s not performance being tested here, but efficiency and heat output. Qualcomm’s Snapdragon S4 is on the right, with two competing products on the left. It appears the model on the far left is Exynos 4210, used in the Samsung Galaxy S II, while the middle device is a TI OMAP 4430, found in the Motorola RAZR.
Watching this video reminded me of an old clip filmed by Tom’s Hardware, showing AMD’s lack of thermal protection for its processors on its now-ancient Socket A Athlons. Fortunately, CPU manufacturers as a whole have come a long way since those dangerous days and although some processors can get very hot without their heatsinks, they won’t self-destruct (usually).